Thin Film deposition
The Cleanroom at LCN on the Bloomsbury site has 255 square metres of ISO 14644-1 Class 6 (Class 1000) cleanroom housing most of our equipment for Plasma etch, Photolithography, Wet Chemical, Metallisation, Furnace, Characterisation and Electron Beam Lithography processes.
We have a Savannah S200 ALD system, equipped with 6 precursor ports, a fomblin vacuum pump, Ozone generator and a Quartz Crystal Monitor.
This equipment has had the vacuum system upgraded to a turbo-molecular high vacuum pump and scroll backing pump. It has a rotary source holder allowing up to 4 different metals to be deposited in sequence in the same vacuum cycle.
This equipment has four independent source positions allowing multiple layers to be deposited without breaking vacuum. The maximum sample size is 200mm diameter, or multiple smaller pieces.
The Edwards Belljar evaporator is a turbo and scroll pumped system capable of evaporating up to 4 different materials in the same vacuum cycle.
Four x 2” sources
Ion Gun System for sample cleaning
Max sample size 3”
Metals include Nb, Au
Lesker PVD75 Sputter Coater system,
Equipped with three Magnetron sputter sources 3 inches in diameter, and any one of which can be selected in sequence. We can use RF or DC power to sputter insulating or conductive materials. The substrate can be cleaned using substrate RF Bias.
Edwards A500 – FL500 Electron Beam Evaporator,
4 pocket Temescal Electron Beam gun
2 thermal sources
Max sample size 6”
Metals include Ti, Au, Mo, Pt
STS Multiplex PECVD, Dual frequency RF, + loadlock, samples up to 6” diameter
Gases: NH3, N2O, O2, SiH4, CF4+ O2, N2.
Deposition of silicon oxide, silicon nitride, and stress controlled siliocn oxynitride.