Spin Coater with chucks for samples from 3x3mm up 150mm diameter, Dehydration oven and two hotplates are located in Bench 1. This set up is for spin coating all materials that are exposed using Ultra-Violet light.
This is a Plasma etcher in a barrel configuration. It is used primariliy for removing organic materials in an Oxygen plasma, such as photoresist. It is an effective technique for cleaning up the residues of photoresist that remain after the Photolithography and develop processes before samples
Karl Suss MJB3 Mask Aligner for small and delicate substrates.
UV 300 Optics for 365nm photoresists
Samples of all shapes from 4mm square up to 3" diamater
Masks from 2" square up to max 4" square 0.060" thick
Soft and hard contact modes
Quintel Q4000-6 Mask Aligner
For whole wafers larger than 2" diameter up to 150 mm diameter
Mask Sizes from 4" square x 0.060", up to 7" square x 0.090".
Infra Red back side alignment option.
Soft and vacuum contact modes