Packaging

AML-AWB Aligner-Wafer Bonder Platform Overview:
• Unique In-situ alignment system (X,Y,Z & θ)
• 1-5 micron accuracy depending on options & wafers
• Automatic PC control & data acquisition
• Application of High Voltage up to 2.5kV

A versatile wedge bonder that can be configured into several different modes.  It is currently set to bond gold wire 25 micrometres in diameter.

On request it can be reconfigured for deep access wire bonding in gold or aluminium.

A Universal Wedge bonder currently set up for bonding Aluminium wire.  The wire diameter is 25 micrometres.

Dicing saw capable of sawing flat substrates up to 150mm diameter.

We can saw Glass, Quartz, Silicon and other materials by suitable choice of blades.

Silicon dicing cuts

Typical: width 70 µm, depth 1000 µm

High precison: width 26 µm, depth 325 µm

CLOSE X