Packaging
The Cleanroom at LCN on the Bloomsbury site has 255 square metres of ISO 14644-1 Class 6 (Class 1000) cleanroom housing most of our equipment for Plasma etch, Photolithography, Wet Chemical, Metallisation, Furnace, Characterisation and Electron Beam Lithography processes.
AML-AWB Aligner-Wafer Bonder Platform Overview:
• Unique In-situ alignment system (X,Y,Z & θ)
• 1-5 micron accuracy depending on options & wafers
• Automatic PC control & data acquisition
• Application of High Voltage up to 2.5kV
A versatile wedge bonder that can be configured into several different modes. It is currently set to bond gold wire 25 micrometres in diameter.
On request it can be reconfigured for deep access wire bonding in gold or aluminium.
A Universal Wedge bonder currently set up for bonding Aluminium wire. The wire diameter is 25 micrometres.
Dicing saw capable of sawing flat substrates up to 150mm diameter.
We can saw Glass, Quartz, Silicon and other materials by suitable choice of blades.
Silicon dicing cuts
Typical: width 70 µm, depth 1000 µm
High precison: width 26 µm, depth 325 µm