Dry Etch
The Cleanroom at LCN on the Bloomsbury site has 255 square metres of ISO 14644-1 Class 6 (Class 1000) cleanroom housing most of our equipment for Plasma etch, Photolithography, Wet Chemical, Metallisation, Furnace, Characterisation and Electron Beam Lithography processes.
Surface Technology Systems ICP RIE, + loadlock, samples up to 6” diameter
Gases: CH4, O2, H2, Ar, Cl, BCl3, SF6, He, N2
Process recipes for etching:
- Diamond; Si; TiSi2; Al; GaAs and InP
Surface Technology Systems ICP DRIE, + loadlock, samples up to 6” diameter
- Gases: O2, Ar, SF6, CF4, C4F8
- Processes:
- Deep Silicon Etch (Bosch process) to 500+ µm
- Shallow Si Etch