The DektakXT is the 10th generation, and latest, profiler from the Dektak Range. It is fast, and has an automated XY Theta sample stage. Vertical reproducibility is 5 Angstrom, and it can measure steps from nm to 1mm deep. It can handle samples that are up to 35mm thick, and up to 300mm in dia
This is a Plasma etcher in a barrel configuration. It is used primariliy for removing organic materials in an Oxygen plasma, such as photoresist. It is an effective technique for cleaning up the residues of photoresist that remain after the Photolithography and develop processes before samples
This equipment has four independent source positions allowing multiple layers to be deposited without breaking vacuum. The maximum sample size is 200mm diameter, or multiple smaller pieces.
This equipment has diffusion High vacuum pump and oil rotary backing pump. It has a rotary source holder allowing up to 4 different materials to be deposited in sequence in the same vacuum cycle, and has a thickness monitor. Operation is entrely manual.
A spin coater with chucks for samples from 3x3mm up to 150mm diameter and a precison vacuum holddown hotplate are dedicated for use with materials that are exposed in the Electrom beam Lithography system.
This is the FFP5000 model of probe equipped with an external probe and sample holder. The stage is capable of accepting wafers up to 100mm diameter and has indexed locations to permit reproducable positioning.