Shallow Reactive Ion Etcher

ICP Reactive Ion Etcher
Equipment manager:
Steve Etienne
Equipment manufacturer:
STS
Equipment model:
Inductively Coupled Plasma
Equipment technique:
Deputy equipment manager:
Vijayalakshmi Krishnan
Maintenance

Service Manual: Download

Manuals

Operators Manual: Download

Surface Technology Systems ICP RIE, + loadlock, samples up to 6” diameter

Gases: CH4, O2, H2, Ar, Cl, BCl3, SF6, He, N2

Process recipes for etching:

  • Diamond; Si; TiSi2; Al; GaAs and InP
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