Dicing Saw

Dicing Saw
Equipment manager:
Steve Etienne
Equipment manufacturer:
Disco
Equipment model:
DAD3220
Equipment technique:
Deputy equipment manager:
Vijayalakshmi Krishnan
Manuals

Standard Operating Procedure: Word

Dicing saw capable of sawing flat substrates up to 150mm diameter.

We can saw Glass, Quartz, Silicon and other materials by suitable choice of blades.

Silicon dicing cuts

Typical: width 70 µm, depth 1000 µm

High precison: width 26 µm, depth 325 µm

Glass dicing cuts:

Typical: width 450 µm, depth 4000 µm

High precion: width 80 µm, depth 1000 µm

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