Standard Operating Procedure: Word
Dicing saw capable of sawing flat substrates up to 150mm diameter.
We can saw Glass, Quartz, Silicon and other materials by suitable choice of blades.
Silicon dicing cuts
Typical: width 70 µm, depth 1000 µm
High precison: width 26 µm, depth 325 µm
Glass dicing cuts:
Typical: width 450 µm, depth 4000 µm
High precion: width 80 µm, depth 1000 µm