Deep Reactive Ion Etcher

Deep Reactive Ion Etcher
Equipment manager:
David Malone
Equipment manufacturer:
STS
Equipment model:
Inductively Coupled Plasma
Equipment technique:
Deputy equipment manager:
Steve Etienne
Maintenance

Maintenance Manual: Downlowd pdf

Manuals

Operators Manual:  Download pdf

Process Considerations: Download pdf

Process Parameter Interactions: Download pdf

Surface Technology Systems ICP DRIE, + loadlock, samples up to 6” diameter

  • Gases: O2, Ar, SF6, CF4, C4F8
  • Processes:
  • Deep Silicon Etch (Bosch process) to 500+ µm
  • Shallow Si Etch
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