AML Anodic Bonder

AML Anodic Bonder
Equipment manager
Steve Etienne
Equipment manufacturer
Applied Microengineering Ltd
Equipment model
Equipment technique
Deputy equipment manager
VJ Krishnan

AML-AWB Aligner-Wafer Bonder Platform Overview:
• Unique In-situ alignment system (X,Y,Z & θ)
• 1-5 micron accuracy depending on options & wafers
• Automatic PC control & data acquisition
• Application of High Voltage up to 2.5kV
• Temperatures up to 560°C
• Forces up to 25,000N
• Self-contained dry pumping system for vacuum up to 10-6 mBar range.
• Forced nitrogen cooling.
• 2” to 8” wafers
• Automatic alignment system