Applied Microengineering Ltd
Deputy equipment manager
AML-AWB Aligner-Wafer Bonder Platform Overview:
• Unique In-situ alignment system (X,Y,Z & θ)
• 1-5 micron accuracy depending on options & wafers
• Automatic PC control & data acquisition
• Application of High Voltage up to 2.5kV
• Temperatures up to 560°C
• Forces up to 25,000N
• Self-contained dry pumping system for vacuum up to 10-6 mBar range.
• Forced nitrogen cooling.
• 2” to 8” wafers
• Automatic alignment system