Cleanroom Tunnel 1 - LCN Bloomsbury

We have a Savannah S200 ALD system, equipped with 6 precursor ports, a fomblin vacuum pump, Ozone generator and a Quartz Crystal Monitor.

AML-AWB Aligner-Wafer Bonder Platform Overview:
• Unique In-situ alignment system (X,Y,Z & θ)
• 1-5 micron accuracy depending on options & wafers
• Automatic PC control & data acquisition
• Application of High Voltage up to 2.5kV

This a a large metal chambered Plasma Cleaner, that uses microwave energy to create a plasma of either Oxygen, Argon or Air. The chamber configuration makes this machine suitable for non planar and three dimensional substrates such as mechanical components and wire bonding substrates. 

The Plasma Pro NGP80 offers versatile plasma etch and deposition solutions on one platform with convenient open loading. This compact, small footprint system is easy to site and easy to use, with no compromise on process quality. 

This is a Plasma etcher in a barrel configuration.  It is used primariliy for removing organic materials in an Oxygen plasma, such as photoresist.  It is an effective technique for cleaning up the residues of photoresist that remain after the Photolithography and develop processes before samples

STS Multiplex PECVD, Dual frequency RF, + loadlock, samples up to 6” diameter

Gases: NH3, N2O, O2, SiH4, CF4+ O2, N2.

Deposition of silicon oxide, silicon nitride, and stress controlled siliocn oxynitride.

Surface Technology Systems ICP RIE, + loadlock, samples up to 6” diameter

Gases: CH4, O2, H2, Ar, Cl, BCl3, SF6, He, N2

Process recipes for etching:

  • Diamond; Si; TiSi2; Al; GaAs and InP

Surface Technology Systems ICP DRIE, + loadlock, samples up to 6” diameter

  • Gases: O2, Ar, SF6, CF4, C4F8
  • Processes:
  • Deep Silicon Etch (Bosch process) to 500+ µm
  • Shallow Si Etch