Equipment

SVS Sputter system
SVS Sputter, Four x 2” sources Ion Gun System for sample cleaning Max sample size 3” Metals include Nb, Au
Lesker Sputterer
Lesker PVD75, three x 3” diameter sources, RF and DC Substrate RF Bias, O2 injection Max sample size 6”. Material capability: Insulators ZnO, ITO,...
Edwards A500 E-Beam evaporator
Edwards A500 – FL500 Electron Beam Evaporator, 4 pocket Temescal Electron Beam gun 2 thermal sources Max sample size 6” Metals include Ti, Au, Mo, Pt
Raith Electron Beam Lithography
Raith 150-TWO Electron Beam Lithography Resolution 20nm  Electron Beam resist processes 495 & 950 PMMA Sample size from 10 x10mm up to 150mm...
Microscope and Camera
Carl Zeiss Axioskop Microscope & Camera, Image Capture and processing software with feature measurement Reflection and or Transmission...
Karl Suss small mask aligner
Karl Suss MJB3 Mask Aligner for small and delicate substrates. UV 300 Optics for 365nm photoresists Samples of all shapes from 4mm square up to 3"...
Quintel Mask Aligner
Quintel Q4000-6 Mask Aligner For whole wafers larger than 2" diameter up to 150 mm diameter Mask Sizes from 4" square x 0.060", up to 7" square x 0....
Plasme Enhanced Chemical vapour Deposition
STS Multiplex PECVD, Dual frequency RF, + loadlock, samples up to 6” diameter Gases: NH3, N2O, O2, SiH4, CF4+ O2, N2. Deposition of silicon oxide,...
STS SRIE
Surface Technology Systems ICP RIE, + loadlock, samples up to 6” diameterGases: CH4, O2, H2, Ar, Cl, BCl3, SF6, He, N2Process recipes for etching:...
STS DRIE
Surface Technology Systems ICP DRIE, + loadlock, samples up to 6” diameterGases: O2, Ar, SF6, CF4, C4F8Processes:Deep Silicon Etch (Bosch process) to...
Disco Dicing Saw
Dicing saw capable of sawing flat substrates up to 150mm diameter.We can saw Glass, Quartz, Silicon and other materials by suitable choice of blades....
JPK Nanowizard 1
The LCN currently has two JPK Nanowizard 1 AFM's to provide high resolution imaging of biological samples using a closed feedback loop to ensure...

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