Equipment

Photoresist Coating
Spin Coater with chucks for samples from 3x3mm up 150mm diameter, Dehydration oven and two hotplates are located in Bench 1.  This set up is for spin...
Tepla Cleaner
This a a large metal chambered Plasma Cleaner, that uses microwave energy to create a plasma of either Oxygen, Argon or Air. The chamber...
Oxford Instruments NGP80 RIE
The Plasma Pro NGP80 offers versatile plasma etch and deposition solutions on one platform with convenient open loading. This compact, small...
Plasma Asher
This is a Plasma etcher in a barrel configuration.  It is used primariliy for removing organic materials in an Oxygen plasma, such as photoresist. ...
Solaris 150
The SSI Inc Solaris 150 Rapid Thermal Processing System (RTP) is a proven, “state of the art” versatile tool for Silicide formation, metal Alloys...
Hitech Furnace
Wafer Furnace with quartzware boat for 4" or  3" diameter wafers.  Maximum  load is 25 wafers.  Maximum temperature is 1100ºC. Gases available are:...
Gold Wire Bonder
A versatile wedge bonder that can be configured into several different modes.  It is currently set to bond gold wire 25 micrometres in diameter. On...
The Drop shape analysis (DSA10 – Krüss) at the LCN is a useful tool for determining the surface properties of solids and liquids using single or...
Temperature 2K – 350K Ultra-high vacuum (better than 5 x 10-11 mbar) Magnetic field: up to 6T in the vertical axis; up to 1T in either horizontal...
Low Temperature: 4K – 300K; Variable Temperature: 300K – 900K Ultra-high vacuum (better than 5 x 10-11 mbar) Active damping to reduce vibration...

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