Plasma Enhanced CVD

Equipment

Overview
Plasme Enhanced Chemical vapour Deposition

STS Multiplex PECVD, Dual frequency RF, + loadlock, samples up to 6” diameter

Gases: NH3, N2O, O2, SiH4, CF4+ O2, N2.

Deposition of silicon oxide, silicon nitride, and stress controlled siliocn oxynitride.