Dicing Saw

Equipment

Overview
Disco Dicing Saw

Dicing saw capable of sawing flat substrates up to 150mm diameter.

We can saw Glass, Quartz, Silicon and other materials by suitable choice of blades.

Silicon dicing cuts

Typical: width 70 µm, depth 1000 µm

High precison: width 26 µm, depth 325 µm

Glass dicing cuts:

Typical: width 450 µm, depth 4000 µm

High precion: width 80 µm, depth 1000 µm

Technique: