Backend Device Processing Lab

• Extracted fume cupboard for general cleaning work
• A Kulicke & Soffa 4123 wire bonder, for forming high quality wire bonds to finished devices.
• A Kulicke & Soffa 4523 wire/Ribbon bonder,with deep access tools.
• Automated  precision dicing saw (DISCO DADS 3230)
  
• A diamond tipped, motorised scriber for dicing chips and wafers.
• Thinning and Polishing using a Logitech lapper
• Large oven for drying & solvent removal