Reactive Ion etching

Oxford Plasma Technology RIE80, Parallel plate, samples up to 150mm diameter

• Gases: CH4, O2, H2, Ar, CHF3, SF6
• etching Si, SiO2, and Si3N4 films and custom etches

Surface Technology Systems ICP RIE, + loadlock, samples up to 150mm diameter

•  Gases: CH4, O2, H2, Ar, BCl3, SF6, He, Cl2, CH4, N2
• Process recipes for etching Diamond; Si; TiSi2; Al; GaAs and InP
• Intellimetrics LEP 300 End Point detector

Surface Technology Systems ICP DRIE, + loadlock, samples up to 150mm diameter

•   Gases: O2, Ar, SF6, CF4, C4F8
• Advanced Silicon Etch (Bosch process) to 500+ µm; Shallow Si Etch