Physical Vapour Deposition

Lesker PVD 75 Sputter System, up to 6" wafer capacity

• Three 3" diameter sources
• Substrate Bias Cleaning mode
• RF and DC modes for Insulators or conductors
• Aluminium, Chrome, SiO2, ITO, ZnO

Edwards A500 Electron Beam Evaporator, 6" wafer capacity

• 4 pocket Temescal Electron Beam gun,
• 2 thermal sources
• Titanium, Gold, Molybdenum, Niobium

Edwards A306 Box Chamber Thermal Evaporator, 6" wafer capacity

• with 4 thermal sources

Edwards A306 Bell Jar Thermal Evaporator

• with 4 thermal sources (Cr, Au & Au alloys only)

Edwards E306A  Bell Jar Thermal Evaporator

• with 4 thermal sources
• Metals available include Cr, Au, Ag, Ni, Al, Ti, Sn & Ge