The Plasma Pro NGP80 offers versatile plasma etch and deposition solutions on one platform with convenient open loading. This compact, small footprint system is easy to site and easy to use, with no compromise on process quality.
It is ideally suited to R&D or small-scale production, and can process from the smallest wafer pieces to 150mm wafers.
In LCN this equipment is configured for Reactive Ion Etching (RIE)
The system is optimised for the etching of layers of Silicon, Silicon Oxide, Silicon Nitride and similar layers. It complements the STS PECVD tool which can deposit these layers.